MediaTek has only announced the Helio X20 SoC last month, and rumours of Helio X30 have begun. Speculations suggest that the upcoming MediaTek chipset will feature a tri-cluster, deca-core setup similar to the Helio X20, manufactured by TSMC’s 10nm FinFET manufacturing process. The first phones powered by this SoC will probably be seen early next year.
According to rumours, MediaTek's Helio X30 might feature ARM’s latest Cortex-A35 and Artemis cores. Artemis is the new, rumoured core architecture from ARM which will be a direct competitor to Qualcomm’s Kryo cores. The A35 core has been stated to provide up to 40% better performance, and lower power consumption. This new setup should increase the overall performance, while decreasing the power consumption in comparison to the existing X20 SoC. The Helio X30 is also expected to get an upgraded GPU, probably a 4-core PowerVR 7XT series GPU. Rumours also suggest that the new SoC might bring support for upto to 26MP cameras, dual main camera support, VR, as well as a new CAT 13 LTE modem.
In the meantime, the company will be selling its Helio X20 and the upcoming X25 SoC (which also uses a deca-core setup) to manufacturers.The Helio X20 is manufactured using the 20nm manufacturing process. It features two Cortex-A72 cores @ 2.5GHz, four Cortex-A53 cores @ 2.0GHz, and four Cortex-A53 cores @ 1.4GHz. It can support 4GB of DDR3 RAM, and comes with a new Mali GPU. The recently-launched Zopo Speed 8 at MWC 2016 is powered by this SoC.
On the other hand, official specifications for the Helio X25 are yet to be announced, but it is expected that the new SoC might run on a slightly higher clock speed. It is also unclear whether MediaTek is making the SoC using the 20nm manufacturing process, or the newer 16nm FinFET manufacturing process.
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